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IC Manufacturing, Package&Test


2024-03-05

[News] PSMC Assists Tata in Fab Establishment through Technology Transfer

IC Manufacturing, Package&Test

According to TechNews, Taiwan's semiconductor foundry, PSMC (Powerchip Semiconductor Manufacturing Corporation) recently announced its collaboration with Tata Electronics in India to establish the country’s first 12-inch wafer fabrication plant in Dholera, Gujarat. In an interview on the 4th, Chai...

2024-02-20

[News] AI Market: A Battleground for Tech Giants as Six Major Companies Develop AI Chips

IC Manufacturing, Package&Test

In 2023, "generative AI" was undeniably the hottest term in the tech industry. The launch of the generative application ChatGPT by OpenAI has sparked a frenzy in the market, prompting various tech giants to join the race. As per a report from TechNews, currently, NVIDIA dominates the market by...

2024-02-19

[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities

IC Manufacturing, Package&Test

With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manu...

2024-02-01

[News] Intensified Competition in the Semiconductor Industry for 2nm Technology Dominance, Potentially Reshaping the Global Foundry Market

IC Manufacturing, Package&Test

The competition for dominance in 2nm semiconductor technology has intensified at the beginning of 2024, marking a crucial battleground among global foundry companies. As per a report from IJIWEI, major foundry enterprises such as Samsung Electronics, TSMC, and Intel are set to commence mass produ...

2024-01-23

[News] Subsidies from the U.S. Legislation “NAPMP” Potentially Expected to Cover IC Substrates

IC Manufacturing, Package&Test

The U.S. Department of Commerce has initiated the "National Advanced Packaging Manufacturing Program (NAPMP) ," with materials and substrates being the first subsidized areas. Due to the close collaboration between IC testing and IC substrates, it is not ruled out that the IC substrate industry coul...

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