Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by employing thermal comp...

On June 18th, Belgium's microelectronics research center IMEC showcased the first CMOS CFET device featuring stacked bottom and top source/drain contacts at the 2024 IEEE VLSI Technology and Circuits Symposium (2024 VLSI). Although the results were achieved using front-side lithography techniques fo...

SK keyfoundry, a subsidiary of memory giant SK hynix, has achieved notable progress in the development of Gallium Nitride (GaN) power semiconductors. According to the latest report by Business Korea, the foundry would begin producing power semiconductors for Tesla in the second half of 2024. Acco...

While TSMC faces overwhelming demand for its 3nm technology, with orders from major clients like Apple and NVIDIA pouring in, Intel has now announced its progress on the 3nm technology. According to the latest report by Tom’s Hardware, Intel 3 has entered high-volume production at two sites, the O...

Samsung is reportedly mulling to update its fabrication capabilities in the Taylor fab near Austin from 4nm to 2nm, and delaying the related equipment orders, according to reports from Tom’s Hardware and Korea media outlet ETnews. The decision is said to be made in Q3 2024. Samsung’s initial ...