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IC Manufacturing, Package&Test


2024-05-27

[News] Google Reportedly Shifts Orders from Samsung to TSMC for Its Upcoming Tensor G5 in the Pixel 10 Series

IC Manufacturing, Package&Test

Google has reportedly collaborated with TSMC on the upcoming Tensor G5 chip, slated for use in the Pixel 10 series smartphone to be released next year, according to media outlet Android Authority, based on information it spotted in trade databases. Google has been cooperating with Samsung on its ...

2024-05-27

[News] UMC’s Global and Local Orders Surge Amid U.S. Tariffs on China and Networking Market Recovery

IC Manufacturing, Package&Test

According to Taiwan's Economic Daily News, UMC has recently engaged in discussions with global giants such as Texas Instruments and Infineon about long-term cooperation plans. Additionally, Taiwan’s two leading IC design companies, MediaTek and Realtek, have seen their inventories of WiFi 6/6E chi...

2024-05-25

[News] Decipher TSMC’s Calm Take on High-NA EUV Lithography Machines: Who May Have the Last Laugh in the Angstrom Era?

IC Manufacturing, Package&Test

This May, we have witnessed two different approaches to the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment between semiconductor giants. Intel has secured the first batch of High-NA EUV kits from ASML, which will allegedly be used on its 18A (1.8nm) and 14A (1.4n...

2024-05-23

[News] IMEC Spearheads the Construction of Sub-2nm Pilot Line Project with a Fund of EUR 2.5 Billion

IC Manufacturing, Package&Test

Belgium-based IMEC Microelectronics Research Center has announced the leading role in establishing the NanoIC pilot line project, for which it has received a total of EUR 2.5 billion from public and corporate donations. As one of the four advanced semiconductor pilot line projects designated by t...

2024-05-22

[News] TSMC More Ambitious on CoWoS Capacity Expansion, Targeting 60% CAGR by 2026

IC Manufacturing, Package&Test

As the demands for AI and HPC processors keep their momentum, driving the usage of advanced packaging technologies, TSMC revealed plans to further expand its chip-on-wafer-on-substrate (CoWoS) capacity at a compound annual rate (CAGR) of over 60% until at least 2026, according to a report by AnandTe...

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