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IC Manufacturing, Package&Test


2024-07-18

[News] TSMC Introduces “Foundry 2.0” to Include Packaging, Testing, Mask making and Others

IC Manufacturing, Package&Test

In the Q2 earnings call today (July 18th), TSMC Chairman and CEO C.C. Wei introduced the concept of “Foundry 2.0,” redefining the foundry industry to further include sectors like packaging, testing, mask making, and others, the latest report by Technews noted. C.C. Wei pointed out that under ...

2024-07-10

[News] TSMC Reportedly Plans to Commence Trial Production for Apple’s 2nm Chips Next Week

IC Manufacturing, Package&Test

After Samsung announced a major breakthrough in 2nm, securing the first batch of orders from Japanese AI company Preferred Networks, its rival TSMC is also advancing. According to reports from Wccftech and ET News, TSMC is set to begin trial production of 2nm chips next week, which would reportedly ...

2024-07-10

[News] Samsung Officially Secures Its First 2nm Order, Making AI Chips for Preferred Networks

IC Manufacturing, Package&Test

Samsung Electronics has received the first client for its 2nm process. According to the official press release from Samsung on July 9th, Samsung Electronics will provide turnkey semiconductor solutions using the 2nm process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to J...

2024-07-05

[News] Micron Reportedly Begins 1γ EUV Trial Production in 2024 amid AI demand

IC Manufacturing, Package&Test

Unlike other major semiconductor manufacturers, including Intel and TSMC, memory giant Micron is not in a hurry to adopt EUV (extreme ultraviolet) lithography for its DRAM production. However, according to a latest report from Technews, in 2024, Micron plans to begin trial production using EUV on it...

2024-07-05

[News] Foundry Giant GlobalFoundries Acquired GaN-Related IP

IC Manufacturing, Package&Test

On July 1, GlobalFoundries (GF), a major foundry player, announced that it has acquired Tagore Technology's production-verified proprietary GaN (Gallium nitride) power IP portfolio, which refers to a high-power density solution designed to enable higher efficiency and better performance of automobil...

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