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IC Manufacturing, Package&Test


2024-09-18

[News] Samsung to Reportedly Begin DS Division Restructuring by Year-end, Aiming to Break down Silos

IC Manufacturing, Package&Test

Regarding the continuous struggle of its foundry business, Samsung has reportedly decided to make another move, as its semiconductor division (DS) plans to undertake a major organizational restructuring within the year, according to a report by Chosun Biz. Through the restructuring, DS Division P...

2024-09-17

[News] More than 30 Projects, Overview of China’s Semiconductor Industry Project Progress in 2024

IC Manufacturing, Package&Test

In 2024, the semiconductor industry has gradually emerged from its downturn and entered a phase of gradual recovery. Observing the market situation, as downstream demand increases, a number of domestic semiconductor industry projects are accelerating. Recently, more than 30 semiconductor-rela...

2024-09-16

[News] Samsung Must Boost AI Processor Yields; 3nm Yield Reportedly at 20% in Q2 2024

IC Manufacturing, Package&Test

Samsung's foundry business has been facing difficulties with its advanced chip processes, particularly with its 3-nanometer production. According to a report from The Korea Times, the yield for Samsung's 3nm process remained in the single digits until Q1 this year, causing delays in supplying engine...

2024-09-16

[News] EU Nods to USD 1.9 Billion Aid to Intel’s Plant in Poland, Provided the Giant Keeps the Project

IC Manufacturing, Package&Test

For Intel, there are finally some good news around the corner. According to a report by The Register, the EU has approved USD 1.9 billion in aid for the struggling giant’s plant in Poland, but with the condition that the company does not abandon the project amid its crisis. The information was ...

2024-09-16

[News] Updated: Rumored China’s DUV Breakthrough – Now Capable of Producing 8-Nanometer Chips

IC Manufacturing, Package&Test

According to a report by the Central News Agency, China's Ministry of Industry and Information Technology (MIIT) recently announced a major technological breakthrough: the development of a deep ultraviolet (DUV) lithography machine capable of producing chips at 8 nanometers and below. This technolog...

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