As the U.S.-China chip war heats up, China is going all-in on AI ASICs, with Huawei’s flagship chips stealing the spotlight. But with rumors of the Ascend 920 entering mass production in 2H25, Commercial Times raises doubts about SMIC’s N+3 process and the chip’s access to top-tier HBM. Acc...

As leading memory giants ramp up preparations for the next-generation high bandwidth memory (HBM) battle, JEDEC—the standards-setting body for the microelectronics industry—has officially released the JESD270-4 HBM4 standard, a new memory standard designed to meet the surging demands of AI workl...

As HBM has emerged as a key battle ground for memory giants amid the surging demand for AI, Micron has created a dedicated business unit for HBM. The company says in its press release that the new structure will be in place by early fiscal Q4, starting May 30, 2025, and financial reporting will foll...

As the U.S. gears up to announce new tariffs on semiconductor products, anxiety is mounting among South Korean memory firms like Samsung and SK hynix. According to Sisa Journal and Asia Business Daily, both manufacture key memory semiconductors—including NAND and DRAM—in China, with their NAND p...

Despite ongoing uncertainty surrounding Trump’s proposed tariffs, leading memory manufacturers are moving forward with HBM development. According to Chosun Biz, industry sources on the 16th indicate that Samsung’s 4nm logic dies have achieved a test production yield exceeding 40%. As these logic...