As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, e...

According to Commercial Times, after reports that Samsung will halt 1y and 1z nm 8GB DDR4 production starting in April, Micron has also informed customers it will discontinue legacy DDR4 modules for servers. This shift reflects a broader industry trend, as memory makers accelerate product transiti...

According to TrendForce's latest memory spot price trend report, regarding DRAM, OEMs are gradually increasing inventory levels to ensure they have safe amounts of stock on hand before tariff policies become clearer, while DRAM suppliers have simultaneously raised spot prices of DRAM products by 8-1...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

Facing rising pressure from Chinese rivals, Samsung has reportedly told clients it will phase out production of 1z nm 8Gb LPDDR4, with the line reaching End of Life (EOL) in April, according to Commercial Times. As noted by Commercial Times, Samsung’s move has been in the pipeline for months, a...