Amid rumors that Huawei is set to launch next-gen AI chips like the Ascend 910D and 920, the tech giant has reportedly teamed up with DeepSeek to integrate its Ascend series with DeepSeek’s budget-friendly AI models. According to TechNews, citing Chinese media outlet 53AI, an "all-in-one machine" ...

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...

As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

With 1y and 1z nm 8Gb DDR4 production reportedly winding down, Samsung is said to be discontinuing its HBM2E products as well, as Commercial Times reveals they’ve reached the Last Buy Order (LBO) stage. Though Samsung declined to confirm the information, this could imply its shift to more high-...

SK hynix saw its Q1 operating profit surging 158% year-over-year, fueled by booming AI chip sales and stockpiling ahead of potential U.S. tariffs, as per Reuters. Despite the upbeat results, the South Korean memory giant warns that elevated macro uncertainties like tariff policy could lead to demand...