Following the latest export curbs on NVIDIA’s H20, the U.S. chip giant is said to be developing a downgraded version of the chip to be sold in China. As the revamped chip is expected to have significant cuts, particularly in memory capacity, a New Daily report hints that NVIDIA might replace HBM...

A surge in DRAM demand—fueled by stockpiling ahead of Trump’s tariffs—seems to be real. According to South Korea’s Etnews, Samsung has raised DRAM prices for the first time in over a year, with DDR4 seeing the sharpest jump. The report suggests that Samsung, finalized new pricing terms wi...

With CEO Jensen Huang calling it a “tremendous loss” to be blocked from China’s AI market, NVIDIA is gearing up to launch a toned-down version of its H20 AI chip for China as early as July, according to Reuters. The report says Team Green has already given major Chinese cloud providers a he...

On May 7, NEO Semiconductor announced a major breakthrough in its 3D X-DRAM technology series: the industry’s first 3D X-DRAM cell structures based on 1T1C and 3T0C architectures. According to NEO Semiconductor, the new technology is designed to deliver unprecedented density, power efficiency, ...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...