Hanmi Semiconductor Forms HBM4 Equipment R&D Team Recently, Hanmi Semiconductor officially announced the establishment of a dedicated team focused on the development of HBM4-related equipment. On May 14, the company launched the “TC Bonder 4,” specifically designed for HBM4 production....

With rumors swirling that top memory makers like Samsung and Micron are scaling back DDR4 production, IT Home and MoneyDJ—citing Nikkei—report that Micron’s EVP confirmed the company has sent end-of-life (EOL) notices for DDR4 and LPDDR4 to PC and data center customers. According to the rep...

AMD officially unveiled its MI350 series GPUs at the Advancing AI 2025 event on June 12—and its key suppliers are now coming into focus. According to Commercial Times, both the MI350X and MI355X are built on TSMC’s N3P node. On the memory front, Sedaily reports that the chips pack 12-high HBM3E ...

As Micron—the key rival in the race to win NVIDIA’s HBM orders—announced it has shipped its first 12-layer HBM4 samples, Samsung reportedly stumbled in its third attempt to pass NVIDIA’s HBM3E 12-layer validation in June. According to Business Post citing securities analysts, the company now...

After unveiling its $100 billion mega fab plan in 2022 and securing $6.1 billion in CHIPS Act funding in 2024, Micron’s long-anticipated chip plant in Clay, New York, is hitting pause once again. Citing syracuse.com, The daily orange reports that groundbreaking is now delayed to late November or D...