According to TrendForce's latest memory spot price trend report, regarding DRAM, spot prices have eased slightly after earlier hikes, especially for DDR4 products, which had seen sharp increases. As for NAND flash, buying sentiment remains weak in the spot market, with prices for once-popular MLC eM...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

During Jensen Huang’s visit to Beijing, NVIDIA revealed that the AI chip giant plans to restart sales of its H20 AI accelerator in China, after receiving assurances from the U.S. government that export licenses will be granted, according to Bloomberg. Notably, as per South Korean media outlet B...

As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily. Sedaily suggests a...

As memory makers move to phase out DDR4, with shipments expected to end in early 2026, contract prices continue to climb. According to China’s Wallstreetcn, SK hynix has raised contract prices for DDR4 and LPDDR4X memory by around 20%, marking a new round of price hikes. This trend echoes findi...