According to TechNews, citing Tom’s Hardware and Blocks & Files, the new memory technology “UltraRAM,” which combines the advantages of DRAM and NAND, has made significant progress toward commercialization. UK-based semiconductor startup Quinas Technology, the developer of UltraRAM, has p...

As the battle for next-gen HBM intensifies, memory giants are gearing up for a surge in demand from NVIDIA’s Rubin. According to ZDNet, NVIDIA plans to complete HBM4 final qualification tests in Q1 2026. However, EE Times notes that with the U.S. chipmaker racing ahead on GPU development, standard...

With NVIDIA reportedly developing its own HBM base die for 2027 production, the spotlight is on memory giants moving base die manufacturing from DRAM to foundry processes. According to South Korea’s Digital Daily, Micron may take the most cautious approach, delaying the shift to foundries until HB...

While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat dissipation. According to its press rel...

According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them. ...