Samsung and SK hynix, though temporarily spared from the risk of U.S. government stake-taking, are running into new obstacles in China as Washington revokes exemptions—granted under Biden after the 2022 export curbs—that previously allowed them to freely import American chipmaking equipment, acc...

According to TechNews, citing Tom’s Hardware and Blocks & Files, the new memory technology “UltraRAM,” which combines the advantages of DRAM and NAND, has made significant progress toward commercialization. UK-based semiconductor startup Quinas Technology, the developer of UltraRAM, has p...

As the battle for next-gen HBM intensifies, memory giants are gearing up for a surge in demand from NVIDIA’s Rubin. According to ZDNet, NVIDIA plans to complete HBM4 final qualification tests in Q1 2026. However, EE Times notes that with the U.S. chipmaker racing ahead on GPU development, standard...

With NVIDIA reportedly developing its own HBM base die for 2027 production, the spotlight is on memory giants moving base die manufacturing from DRAM to foundry processes. According to South Korea’s Digital Daily, Micron may take the most cautious approach, delaying the shift to foundries until HB...

While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat dissipation. According to its press rel...