Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...

While Micron reportedly passed NVIDIA’s verification and became the first of the big three memory makers to ship SOCAMM (Small Outline Compression Attached Memory Module), the U.S. AI chip giant may revise its adoption plan for this new low-power DRAM (LPDDR) server memory module—a move that cou...

According to The Elec, KAIST Professor Kim Jeong-ho noted that HBF (High Bandwidth Flash)—NAND flash stacked like HBM—could become a decisive factor for the future of AI. As the report explains, HBF resembles HBM in structure, with dies stacked and linked by through-silicon vias (TSVs). The key ...

As global data center deployments accelerate, cloud giants are shifting their demand from training AI to inference AI, driving sustained growth in high-capacity memory requirements and causing memory supply constraints to migrate from DRAM to NAND. Supply chain sources reveal that following SanDisk'...

According to ZDNet, Samsung Electronics is ramping up efforts to secure production capacity for 1c DRAM as it aims to take an early lead in HBM4. Industry sources say the company plans to complete equipment investments for 1c DRAM at its Pyeongtaek Campus 4 (P4) by the first half of next year. Sa...