Amid circulating rumors that NVIDIA may drop SOCAMM1 (Small Outline Compression Attached Memory Module) in favor of SOCAMM2 due to technical challenges, Etoday and DealSite indicate that the U.S. AI chip giant has placed next-year SOCAM module orders with Samsung, SK hynix, and Micron, likely distri...

With top memory makers reportedly raising prices amid tight supply, The Chosun Daily, citing TrendForce, highlights that by the end of Q3 2025, global DRAM inventories averaged just 3.3 weeks—matching the lows of 2018 and signaling a supercycle in the memory market could be on the way. The repo...

With the HBM4 era on the horizon and SK hynix and Micron preparing for production ramp-up from late 2025 through 2026, it is an ideal time to explore how HBM (High Bandwidth Memory) is built, its key advantages and technologies related, and why its manufacturing complexity drives high costs. Here’...

With HBM turning into a scarce resource in the AI boom and imports effectively off-limits, China is racing to develop its own supply, with major tech firms joining the push. Reuters reports that Yangtze Memory Technologies Co. (YMTC), the country’s leading NAND maker, is gearing up to enter the DR...

According to TrendForce's latest memory spot price trend report, regarding DRAM, among different product categories, DDR4 chips are still experiencing the most significant price hikes, with the average spot price of mainstream chips (i.e., DDR4 1Gx8 3200MT/s) increasing by 6.88% US$5.947 this week. ...