As Samsung actively expands its high-bandwidth memory (HBM) capabilities, it is also striving to enhance the penetration rate of its existing memory products in mobile devices such as smartphones. On July 16, Samsung announced that it has completed verification of its latest LPDDR5X DRAM, which can ...

According to a report by Yonhap News Agency, data released by Korea's Ministry of Science and information and communication technology ICT on July 15 shows that in the first half of this year, Korea's ICT industry exports grew by 28.2% YoY to USD 108.85 billion, setting the second-highest record for...

As per a report from Korea Economic Daily citing unnamed sources on July 15th, Samsung Electronics is preparing to mass-produce the logic die for HBM4 using its advanced 4nm process. The logic die, situated at the bottom of the chip stack, is a core component of HBM. Memory manufacturers are alr...

Though Samsung has denied the rumor that its HBM3e passed NVIDIA’s qualification tests, multiple Taiwanese companies in the supply chain reportedly learned that the product is expected to receive certification soon, and will start shipping in Q3. As memory manufacturers are said to shift at least ...

As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week. According to its press release and a report f...