According to a previous report from Bloomberg, Chinese 3D NAND Flash giant YMTC recently filed a lawsuit against American memory giant Micron in California, accusing Micron of infringing on 11 of its patents related to 3D NAND Flash and DRAM products. YMTC is requesting the court to order Micron to ...

TSMC continues to showcase its drive in the advanced packaging market. According to a report from MoneyDJ, TSMC has forecasted that CoWoS will remain in high demand through 2025, with potential for capacity to double in two consecutive years. TSMC is also entering the FOPLP (Fan-Out Panel-Level Pac...

As Samsung eagerly accelerates its pace on the HBM3e certification with NVIDIA, SK hynix, the current HBM market leader, is reportedly planning another move to strengthen its relationship with the AI giant. According to a report by Korean media Money Today, SK hynix is teaming up with Amkor Technolo...

According to TrendForce's latest memory spot price trend report, DRAM spot prices have finally stabilized as Samsung is committed to propping them up. Spot prices of DDR4 products, in particular, continue the momentum. As for NAND flash, demand for a small extent of inventory replenishment remains p...

As Samsung actively expands its high-bandwidth memory (HBM) capabilities, it is also striving to enhance the penetration rate of its existing memory products in mobile devices such as smartphones. On July 16, Samsung announced that it has completed verification of its latest LPDDR5X DRAM, which can ...