Subject


DRAM


2025-04-23

[News] Micron Reportedly Joins Samsung in Cutting DDR4 Output, Boosting Taiwanese Suppliers

DRAM

According to Commercial Times, after reports that Samsung will halt 1y and 1z nm 8GB DDR4 production starting in April, Micron has also informed customers it will discontinue legacy DDR4 modules for servers. This shift reflects a broader industry trend, as memory makers accelerate product transiti...

2025-04-23

[Insights] Memory Spot Price Update: DRAM Suppliers Raise Prices by 8-10% amid Stockpiling ahead of Tariffs

DRAM

According to TrendForce's latest memory spot price trend report, regarding DRAM, OEMs are gradually increasing inventory levels to ensure they have safe amounts of stock on hand before tariff policies become clearer, while DRAM suppliers have simultaneously raised spot prices of DRAM products by 8-1...

2025-04-23

[News] The TC Bonder Drama: Could Hanmi’s Supply Shift the HBM Race Between Micron, SK hynix, and Samsung?

DRAM

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

2025-04-22

[News] Samsung Rumored to End DDR4 Production in April as Chinese Competition Grows

DRAM

Facing rising pressure from Chinese rivals, Samsung has reportedly told clients it will phase out production of 1z nm 8Gb LPDDR4, with the line reaching End of Life (EOL) in April, according to Commercial Times. As noted by Commercial Times, Samsung’s move has been in the pipeline for months, a...

2025-04-21

[News] Huawei’s Ascend 920 Reportedly Set for 2H25 : Concerns Grow Over SMIC’s Capability and HBM Access

DRAM

As the U.S.-China chip war heats up, China is going all-in on AI ASICs, with Huawei’s flagship chips stealing the spotlight. But with rumors of the Ascend 920 entering mass production in 2H25, Commercial Times raises doubts about SMIC’s N+3 process and the chip’s access to top-tier HBM. Acc...

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