As AI chip giants like NVIDIA and AMD race ahead with next-gen HBM adoption, SK hynix is reportedly taking a more cautious stance on the investment in 1c DRAM (6th-gen 10nm-class), according to South Korean media outlet the bell. The move reflects the company’s strategy to double down on the more ...

Hanmi Semiconductor Forms HBM4 Equipment R&D Team Recently, Hanmi Semiconductor officially announced the establishment of a dedicated team focused on the development of HBM4-related equipment. On May 14, the company launched the “TC Bonder 4,” specifically designed for HBM4 production....

With rumors swirling that top memory makers like Samsung and Micron are scaling back DDR4 production, IT Home and MoneyDJ—citing Nikkei—report that Micron’s EVP confirmed the company has sent end-of-life (EOL) notices for DDR4 and LPDDR4 to PC and data center customers. According to the rep...

AMD officially unveiled its MI350 series GPUs at the Advancing AI 2025 event on June 12—and its key suppliers are now coming into focus. According to Commercial Times, both the MI350X and MI355X are built on TSMC’s N3P node. On the memory front, Sedaily reports that the chips pack 12-high HBM3E ...

As Micron—the key rival in the race to win NVIDIA’s HBM orders—announced it has shipped its first 12-layer HBM4 samples, Samsung reportedly stumbled in its third attempt to pass NVIDIA’s HBM3E 12-layer validation in June. According to Business Post citing securities analysts, the company now...