While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat dissipation. According to its press rel...

According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them. ...

Currently, in fields such as autonomous driving, smart home systems, and industrial control, there is an increasing demand for edge-intelligent hardware to locally process real-time environmental data generated by sensors and smart devices, thereby minimizing decision latency. Neuromorphic hardware ...

According to Chosun Biz, Intel’s financial strain, sweeping restructuring under CEO Lip-Bu Tan, and the cancellation of multiple projects have triggered an exodus of key talent — prompting Samsung Electronics and its affiliate Samsung Electro-Mechanics to reportedly recruit these departing Intel...

According to TrendForce's latest memory spot price trend report, regarding DRAM, the main focus for 3Q25 has been the rebound in contract prices, but trading momentum has gradually slowed down recently, with prices of DDR5 and DDR4 products experiencing slight declines. Meanwhile, in terms of NAND, ...