At a time when the memory industry is in the midst of a boom deeply driven by artificial intelligence (AI), major memory makers are unanimously shifting their strategic focus toward AI-oriented storage solutions featuring high bandwidth, large capacity, and low power consumption. As demand for high-...

With Micron setting its groundbreaking for the massive Clay, New York, chipmaking complex on January 16, syracuse.com reports that Commerce Secretary Howard Lutnick—whose department will oversee up to $20 billion in federal subsidies—is slated to attend the ceremony, alongside Micron CEO Sanjay ...

According to TrendForce's latest memory spot price trend report, regarding DRAM, spot prices continue their daily climb, even as trading stays muted with suppliers and traders holding back inventory, pushing the average price of mainstream DDR4 1Gx8 3200MT/s chips up 9.64%. Meanwhile, in NAND, while...

As previously reported by ZDNet, SK hynix is exploring plans for its first U.S. HBM packaging facility. Meanwhile, the memory giant is accelerating its domestic expansion, announcing today a KRW 19 trillion investment in a new advanced packaging fab, P&T7, at its Cheongju site. The facility is p...

As Micron prepares to break ground on its New York Mega fab on January 16, the company’s outlook on the global memory market remains under close watch. Wccftech, citing Micron’s VP of Marketing for the Mobile and Client Business Unit, Christopher Moore, emphasized that the ongoing memory shortag...