With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates ...

Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering with GlobalFoundries to co-develop and produce advanced GaN ...

As SK hynix ramps up ties with major tech players like NVIDIA, advancing U.S. production through its Indiana advanced packaging plant is just one part of its strategy. According to the Puget Sound Business Journal via The Guru, the memory giant has now secured a new office in Seattle’s Bellevue ar...

Samsung has officially unveiled its long-awaited Exynos 2600, developed by its Device Solutions (DS) division and manufactured by Samsung Foundry. According to Business Post, the Exynos 2600 is the industry’s first application processor built on a 2nm Gate-All-Around (GAA) process. On the 19th, Sa...

Following Texas Instruments’ largest-ever price hike in August, Analog Devices (ADI), the world’s second-largest analog chipmaker, has officially informed customers of a new price increase set to take effect February 1, 2026, according to a notice seen by EE Times China. The notice did not li...