BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

As 8-inch capacity tightens and operating costs climb, foundries are bracing for a new wave of price hikes. Following Chinese peers led by SMIC, Nexchip, the country’s third-largest foundry, announced on March 12 a 10% increase in foundry fees starting June 2026, TechNews reports. According to ...

NVIDIA and Samsung are taking their partnership beyond HBM for GPUs. On March 6, researchers from Samsung Semiconductor Research, NVIDIA, and Georgia Tech unveiled the PINO (Physics-Informed Neural Operator) AI model, capable of analyzing ferroelectric NAND performance 10,000× faster than tradition...

Samsung Electronics is reportedly stepping up cost-cutting efforts within its Device Experience (DX) division, which oversees its smartphone business as well as TVs and home appliances. According to Hankyung, industry sources say the DX division is reviewing a range of cost-reduction measures under...

After formally signing an exclusive letter of intent to acquire Powerchip Semiconductor Manufacturing Corp. (PSMC)’s P5 fab in Tongluo for US$1.8 billion, Micron has begun moving the deal forward. According to TechNews, the memory giant recently sent out a confidential invitation announcing a tool...