While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat dissipation. According to its press rel...

While Intel recently agreed to transfer a 10% stake to the U.S. government, the chipmaker continues to suffer from a wave of veteran executive departures. As per Oregon Live, Narahari Ramanuja, a 25-year Intel veteran, is leaving to head Analog Devices’ newly expanded Oregon facility. Notably, ...

According to South Korean outlet Business Post, sources indicate that Samsung is weighing investment in Intel’s packaging business — an area where Intel has a competitive edge — and is also exploring the use of Intel’s packaging production lines in the U.S. Sources highlight Samsung’s n...

Shortly after the TSMC 2nm leak involving former and current staff came to light, Taiwan’s High Prosecutors Office indicted three engineers on August 27 for misappropriating national core technology secrets. Prosecutors are seeking 7–14 year prison terms under national security and trade secret ...

According to Financial Times, China aims to triple its overall AI processor output next year. The report, citing sources, notes that one fab dedicated to manufacturing Huawei’s AI chips is slated to begin production by the end of this year, with two additional plants expected to come online in 202...