In the previous articles (China Strives to Break Through U.S. Restrictions in Mature Processes, Aiming for Over 30% Global Share by 2027 and China’s Wafer Fabs Hits 44 with Future Expansion 32, Mainly Targeting on The Mature Process) we explored the overall layout of Chinese wafer fab and develo...

DRAM spot prices increased slightly this week due to supplier quotes and anticipation of 4Q23 contract hikes, stabilizing with ongoing production cuts. In NAND Flash, active pre-sales peak inquiry didn't significantly impact transactions. Future trends depend on promotions; 512Gb TLC wafer spots exp...

The latest official data from South Korea, the world's largest memory production country, indicates a turnaround in October's memory exports, marking the first growth in nearly 16 months. Meanwhile, the latest report from the Taiwan Semiconductor Industry Association (TSIA) anticipates a quarter-on-...

Despite the U.S. sanction on the semiconductor industry in China, China is still positively looking for further development. Following our discussion on the shifts of Chinese wafer fabs in the previous article (China’s Wafer Fabs Hits 44 with Future Expansion 32, Mainly Targeting on The Mature P...

On November 13, NVIDIA unveiled the AI computing platform HGX H200, featuring the Hopper architecture, equipped with H200 Tensor Core GPU and high-end memory to handle the vast amounts of data generated by AI and high-performance computing. This marks an upgrade from the previous generation H100,...