Subject


Semiconductors


2024-05-06

[News] TSMC’s Advanced Packaging Capacity Fully Booked by NVIDIA and AMD Through Next Year

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It's reported by the Economic Daily News that they have secured TSMC's advanced packaging capacity for CoWoS and SoIC packaging through this year and the ...

2024-05-03

[News] NVIDIA Reportedly Fueling Samsung and SK Hynix Competition, Impacting HBM Pricing?

According to South Korean media outlet BusinessKorea's report on May 2nd, NVIDIA is reported to be fueling competition between Samsung Electronics and SK Hynix, possibly in an attempt to lower the prices of High Bandwidth Memory (HBM). The report on May 2nd has cited sources, indicating that th...

2024-05-03

[News] PSMC’s New Tongluo Plant Unveiled, CoWoS Packaging Ready to Roll

Powerchip Semiconductor Manufacturing Corporation (PSMC) held the inauguration ceremony for its new Tongluo plant on May 2nd. This investment project, totaling over NTD 300 billion  for a 12-inch fab, has completed the installation of its initial equipment and commenced trial production. According ...

2024-05-03

[News] TSMC Reportedly Commences Production of Tesla’s Next-Generation Dojo Chips, Anticipates 40x Increase in Computing Power in 3 Years

Tesla's journey towards autonomous driving necessitates substantial computational power. Earlier today, TSMC has confirmed the commencement of production for Tesla's next-generation Dojo supercomputer training chips, heralding a significant leap in computing power by 2027. As per a report from Te...

2024-05-02

[News] HBM Craze Continues! SK Hynix Reports Sold Out for this Year, Next Year’s HBM Capacity Nearly Fully Booked

SK Hynix CEO Kwak Noh-Jung announced on May 2nd that the company's HBM capacity for this year has already been fully sold out, and next year's capacity is also nearly sold out. From a technological perspective, SK Hynix plans to provide samples of the world's highest-performance 12-layer stacked HBM...

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