According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

Samsung has been strengthening its alliance regarding the semiconductor packaging technology, attempting to narrow the technological gap with TSMC, according to the latest report by Business Korea. Citing industry sources, Business Korea noted that Samsung is expected to expand its 2.5D and 3D MD...

The New York Times reported on June 5th that the U.S. Department of Justice (DOJ) and the Federal Trade Commission (FTC) have reached an agreement, led by senior officials of both agencies, over the past week. The DOJ will investigate whether NVIDIA has violated antitrust laws, while the FTC will ex...

Dutch semiconductor equipment giant ASML has hinted at the potential for receiving significant orders from key customer TSMC in the coming quarters, according to a June 5th report from Reuters. Reuters, citing information disclosed at a Jefferies-hosted investor call, noted that ASML's CFO, Rog...

Driven by the rapid growth in demand for high-bandwidth memory (HBM) fueled by artificial intelligence (AI), memory manufacturers are vying for market opportunities. According to a report from CNA, Micron has announced its target to achieve a 20% to 25% market share in HBM by 2025. Targeting the...