As memory giants race to advance their HBM roadmaps, DDR5 continues to be a key battleground in the push toward high-end memory. According to Wccftech, citing a leaker from Team Group, a new generation of SK hynix DDR5 has surfaced online. The chips appear to be second-generation 3Gb A-die memory im...

EUV lithography has become the cornerstone of advanced chip manufacturing, and as the foundry race intensifies at ever-smaller nodes, major players are accelerating the development of related technologies. According to Nikkei XTECH, TSMC has significantly ramped up its patent filings in semiconducto...

Southeast Asia is fast becoming a key semiconductor hub, particularly in advanced packaging, attracting major players to expand their regional footprint. Taiwan-based chip packaging giant ASE announced a strategic partnership with Analog Devices (ADI) on Oct. 21, signing a binding MoU to acquire ADI...

As data center expansion accelerates and cloud leaders shift focus from AI training to inference, demand for high-capacity memory is surging, fueling a swift recovery in the global NAND Flash market. According to ZDNet, sources indicate that Samsung Electronics has ramped up operations at its main N...

On October 15, a research team led by Professor Fang Lu from the Department of Electronic Engineering at Tsinghua University announced the successful development of “Yuheng,” the world’s first sub-ångström snapshot spectral imaging chip. The breakthrough has been published online in the pres...