Global Unichip Corp. (GUC), a leading provider of advanced ASIC solutions, announced that its 3nm HBM3E Controller and PHY IP have been adopted by a major cloud service provider and several high-performance computing (HPC) companies. The cutting-edge ASIC is expected to tape out this year, featuring...

A month ago, Kioxia has reportedly submitted its initial public offering (IPO) application to the Tokyo Stock Exchange. However, as the memory market recently seems to be on a roller coaster ride, the latest report by Reuters notes that the Japanese memory chip maker has decided to cancel its plan t...

Recently, several 6-inch production lines have made significant advancements, focusing on third-generation semiconductor materials like silicon carbide (SiC) and gallium oxide (Ga2O3). NEXIC Successfully Completes First Wafer Batch in Its Fab On September 21, NEXIC announced that it had succes...

According to The Hindu, India, under a transformative partnership with the U.S., is set to establish its first national security semiconductor fabrication plant. This facility will produce chips for military hardware in both nations, as well as for critical telecommunications and electronics network...

MediaTek announced on its official Weibo account that its next-generation flagship chip will be unveiled on October 9. According to TechNews, MediaTek's upcoming next-generation chip is the annual flagship smartphone processor, the Dimensity 9400. Based on the expected release date, it will be un...