YMTC, known for its hybrid bonding patent deal with Samsung and its push toward 294-layer NAND production, has quietly revealed mounting losses. Financial disclosures tied to an investment by Hebei Yangyuan Zhihui Beverage Co showed that YMTC posted an 84 million yuan (about US$11.6 million) loss in...

It’s reported that a team of 30 scientists from the Indian Institute of Science (IISc) has submitted a proposal to the government to develop Angstrom-scale chips, which will leverage new semiconductor technologies based on two-dimensional (2D) materials. The proposal suggests that using these adva...

Intel’s new CEO, Lip-Bu Tan, has just completed his first earnings call, demonstrating a strong commitment to driving the company’s transformation. As noted by a report from Commercial Times, Intel’s next-generation CPU, Nova Lake, will combine in-house production with outsourcing to TSMC for ...

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...

With the U.S. tightening chip export controls, China is reportedly exploring a more drastic solution. According to Korean media outlet etnews, the Chinese government is pushing to consolidate the country’s semiconductor equipment companies into about 10 key players. The report suggests that due...