As Qualcomm and Samsung push into the 2nm era with the Snapdragon 8 Elite Gen 2 and Exynos 2600, Taiwan’s MediaTek confirmed at its July 30 earnings call that it’s also gearing up for 2nm, targeting edge and cloud AI chips—with tape-out expected in September, according to the Economic Daily Ne...

As reported by Reuters, citing sources, NVIDIA recently placed a 300,000-unit order for H20 with TSMC, reversing its earlier plan to rely solely on existing inventory due to strong demand from China. Economic Daily News highlights that this substantial order reflects continued robust demand from Chi...

According to South Korean media outlet The Korea Economic Daily, Samsung is reportedly considering further investment in its Taylor, Texas plant. Specifically, the company is said to be reviewing the addition of an advanced packaging line alongside its foundry and R&D facilities. The report n...

According to TrendForce's latest memory spot price trend report, regarding DRAM, trading activities have slowed down for DDR4 products compared with the previous week, while x16 consumer DRAM products have stronger price support compared with x8 PC DRAM products. As for NAND flash, some of the buyer...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...