[News] CXMT Starts LPDDR6 Mass Production at 12,800Mbps; Open to Global Customers as Apple Ties Draw Attention
China’s leading DRAM maker CXMT has officially announced mass production of LPDDR6, with the next-generation memory making its commercial debut in Xiaomi’s newly launched Xiaomi 18 Fold flagship foldable. According to CXMT, based on internal testing, its LPDDR6 delivers up to 60% higher peak bandwidth and 20% lower power consumption than LPDDR5X running at 10,667Mbps.
CXMT said the new memory reaches a peak data rate of 12,800Mbps and operates at 10,667Mbps when paired with the SoC. The 16GB packaged chip, built on 16Gb dies and compliant with the JEDEC LPDDR6 standard, comes in a 1,295-ball FBGA package.
CXMT’s broader DRAM position is also strengthening. According to TrendForce, the company’s global DRAM revenue share rose to 9.5% in 2Q26 from 7.6% in 1Q26, placing it fourth behind Samsung at 39.4%, SK hynix at 24.9%, and Micron at 23.3%.
CXMT’s LPDDR6 Specs Put It in Range of Samsung, SK hynix
Notably, General Manager Zhao Lun told 21st Century Business Herald that CXMT’s products are now competitive with leading international suppliers in performance, quality, and supply stability. Its LPDDR6 specifications also put the company within range of products being developed by global memory leaders.
SK hynix announced in March that it had completed development of 16Gb LPDDR6 based on its 1c (10nm-class) process, with a processing speed improvement of 33% over LPDDR5X and a default operating speed above 10.7Gbps. The company plans to complete mass-production preparations in the first half of the year and begin shipments in the second half, according to Yonhap News.
Samsung Electronics, meanwhile, showcased its LPDDR6 at CES 2026 in January but has yet to disclose a mass-production timeline. However, a previous TechPowerUp report, citing ISSCC 2026 data, provided further details on the two Korean memory giants’ planned specifications.
Samsung’s 16Gb LPDDR6, built on a 12nm process, is slated to run at 12.8Gbps, up from the 10.7Gbps version announced in January, TechPowerUp noted. SK hynix, on the other hand, is reportedly targeting an even higher 14.4Gbps for its 16Gb LPDDR6 modules.
CXMT’s HBM Push, Apple Ties in Focus
At a September 7 investor briefing on its 2026 interim results, CXMT General Manager Zhao Lun addressed market speculation over the company’s reported product validation with Apple. According to 21st Century Business Herald, Zhao said CXMT remains open to exploring partnerships with high-quality customers worldwide, adding that its products are now competitive with leading international suppliers in performance, quality, and supply stability.
However, as highlighted by Wccftech, Apple is likely to rely on CXMT for only part of its China-related memory demand, estimated at around 600 million GB (50 million units × 12GB per device), given the memory maker’s capacity constraints. CXMT’s capacity is reportedly fully booked through 2027 at a 95% utilization rate, limiting its ability to fully absorb Apple’s potential demand.
On HBM development, Zhao said CXMT will continue to advance its products and process technologies in line with its technology roadmap and business plans.
The company is also putting substantial resources behind next-generation DRAM technologies. According to Phoenix News, RMB 9 billion of CXMT’s RMB 29.5 billion IPO proceeds is earmarked for advanced DRAM R&D, with HBM and related advanced packaging technologies identified as key development priorities.
Read more
- [News] CXMT Gross Margin Hits 87% in Q2 to Rival Memory Giants, as LPDDR6 Mass Production Reportedly Begins
- [News] Xiaomi XRING O3 Reportedly Features CXMT LPDDR6, TSMC 3nm, May Expand TSMC Ties to AI and Auto Chips
(Photo credit: CXMT)
