[News] ASE Targets FOPLP Mass Production by End-2026, Launches 15 Expansion Projects This Year Amid AI Boom

As TSMC accelerates development of CoPoS (Chip-on-Panel-on-Substrate), Taiwan OSAT leader ASE is also making steady progress in fan-out panel-level packaging (FOPLP). According to TechNews, citing COO Tien Wu at the June 24 shareholders’ meeting, ASE’s first fully automated high-volume production line for FOPLP is expected to enter mass production by end-2026.

Wu, as per the report, added that customer alignment, equipment installation, and qualification processes are all progressing smoothly, with ASE aiming to announce a formal milestone at its end-2026 or early-2027 earnings call.

Capacity Expansion in Full Swing

Meanwhile, amid surging demand for advanced packaging, ASE is stepping up its expansion efforts. According to Liberty Times, ASE and its subsidiary SPIL plan to launch around 15 new fab and expansion projects this year, targeting demand beyond 2029–2030 and the ongoing AI-driven cycle, while aiming to avoid past capacity bottlenecks.

Capex momentum is also accelerating. The company’s capital expenditure has increased from about US$2 billion to US$5.3 billion last year, and further to US$8.5 billion this year, with additional upside potential, Liberty Times adds. Wu, cited by Economic Daily News, also noted that ASE’s capital expenditure is expected to remain elevated in 2027.

Notably, TechNews also highlights that ASE is also expanding with rapid speed overseas. Wu, cited by the report, noted that ASE continues to expand in the U.S., including two long-established test and R&D centers in California, with plans for a third and fourth. In Arizona, projects tied to TSMC and U.S. customers are also progressing, he added.

Looking ahead, Wu said the company expects steady revenue growth this year, with advanced packaging revenue projected to double from 2025 levels, driven by robust AI-related semiconductor demand, Economic Daily News reports.

Read more

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(Photo credit: ASE)