[News] MTC and Changelight Forge Strategic Partnerships to Advance Micro LED Optical Interconnect Technologies
The AI era is creating a historic opportunity for the upgrade of high-speed, short-reach optical interconnects. According to the latest forecast from TrendForce, the market value of Micro LED-based co-packaged optics (CPO) transceiver modules is projected to reach USD 848 million by 2030. Against this backdrop, two major Chinese LED chipmakers have announced new strategic partnerships aimed at accelerating commercialization efforts.
SMTC and Hunan Normal University Establish Joint Micro LED CPO Lab
On May 28, SMTC and the Future Technology Institute of Hunan Normal University jointly announced the establishment of the Hunan Normal University–SMTC Semiconductor Joint Laboratory for Micro LED Co-Packaged Optics (CPO).
The joint lab will focus on collaborative R&D in Micro LED optical communications, with key efforts directed toward enhancing the communication performance of single-pixel and array-based Micro LED chips, building testing and validation platforms, and verifying prototype systems. SMTC plans to advance the program according to a roadmap targeting tape-out adaptation in 2026, integrated sample delivery in 2027, and pilot volume production in 2028.
The Future Technology Institute, recently established by Hunan Normal University, specializes in frontier technologies such as optoelectronic chips and talent development. The institute operates advanced R&D and proof-of-concept platforms for photonic integration and advanced packaging, supporting capabilities including DUV lithography, electron-beam lithography (EBL), ICP micro/nano fabrication, optoelectronic co-packaging, wafer-level flip-chip bonding, active optical coupling, ultrahigh-speed optical module testing, and optical link prototype validation.
SMTC brings extensive expertise in Micro LED chip development and a vertically integrated presence across the optical communications value chain.
At the chip level, SMTC leveraged 20 AIXTRON 2800G4 systems and the technological synergies between LED chips and semiconductor laser chips in epitaxial growth and chip processing to build a semiconductor laser chip production line with annual capacity of 100 million units by the end of 2024. In March this year, the company completed development of a Micro LED chip targeting Micro LED CPO applications and entered the sample validation stage.
Meanwhile, since entering the optical communications sector through acquisitions in 2023, SMTC has gradually established a vertically integrated ecosystem spanning optical communication devices, optical modules, and core optical chips.
Optical chips: SMTC has begun shipments of DFB laser chips below 25G after passing reliability validation, while CW DFB laser chips have successfully completed static performance testing and entered customer sampling programs.
Optical module: Products rated at 200G and below have already reached mass production. SMTC has also completed equipment installation and commissioning for its first 400G and 800G parallel optical transceiver manufacturing lines, which have entered pilot production following reliability qualification.
Additionally, MTC’s Wuhan Optical Communications R&D Center has officially commenced operations, further strengthening its nationwide R&D network and supporting faster technology commercialization through industry-academia collaboration.
Changelight and Jinghe Join Hands to Develop Micro LED Automotive Lighting and Optical Interconnects
On May 29, Changelight and Shanghai Jinghe Optoelectronics signed a strategic cooperation agreement covering areas including Micro LED automotive lighting and optical interconnect technologies.
Jinghe has long specialized in automotive LED lighting and has recently been transitioning from a conventional automotive lighting module supplier to a semiconductor light-source chip developer. Its self-developed “Huaxin No. 1” chip is approaching mass-production readiness.
The company has also established a comprehensive technology portfolio encompassing CMOS driver IC design, high-power Micro LED advanced packaging, and automotive lighting controllers. Its products have been adopted by more than 10 domestic automakers across over 30 vehicle models, with cumulative installations reaching several million units.
The reliability, high-temperature tolerance, and lifetime requirements for Jinghe’s automotive-grade Micro LED products significantly exceed those of commercial applications, enabling rapid migration into data-center optical interconnect scenarios. The company is currently building an automotive-grade Micro LED advanced packaging production line whose core processes are highly compatible with those used for Micro LED optical engine chip packaging. This allows a single production line to serve both automotive and optical interconnect applications, shortening development cycles and reducing commercialization risks.
Changelight has made steady progress in the development and industrialization of high-speed optical chips. Its 10G and 25G VCSEL chips have already been sampled to customers and are currently undergoing qualification, with commercial orders and deliveries expected in 2026.
The company is also working closely with a Hisense-affiliated optical module manufacturer to advance key optical chip technologies, including VCSELs and Micro LEDs. To address commercialization requirements for short-reach CPO optical interconnects, Changelight has developed a high-speed demonstration platform to validate core performance metrics.
As AI infrastructure continues to drive demand for higher-bandwidth and lower-power optical interconnects, partnerships between LED chip manufacturers, universities, and downstream optical communications players are increasingly accelerating the transition of Micro LED technologies from display applications to next-generation optical networking.
(Photo credit: FREEPIK)
