[News] China Memory Expansion Lifts Domestic Equipment Suppliers: AMEC, Wuhan Jingce, Hwatsing, ACM in Focus
While the rapid expansion of major Chinese memory players has drawn growing market attention, Reuters reports that more than half of the equipment used in one of the new fabs may have been sourced from domestic suppliers, including key systems for vertical chip-layer stacking. If confirmed, this could serve as both a proving ground and a major growth opportunity for local semiconductor equipment makers amid the memory boom, as U.S. export restrictions continue to tighten.
Next, let’s take a closer look at key domestic beneficiaries across the memory equipment supply chain in China.
AMEC Gains Traction in Memory Push
As reported by MyDrivers, domestic equipment typically accounts for just 15%–30% across Chinese fabs. Notably, the report suggests domestically sourced tools could now cover critical processes including 3D NAND vertical stacking, with Advanced Micro-Fabrication Equipment (AMEC) among the core local suppliers.
Jiemien News further notes that AMEC has seen its etching systems gain traction within Chinese fabs. As of end-2025, its cumulative global shipments of etch reactors exceeded 6,800 units, the report indicates, adding that the company’s tungsten CVD (WCVD) systems for contact applications have also completed volume production validation at leading local memory makers and begun receiving batch orders.
Meanwhile, citing AMEC, Calian Press notes that the transition of memory devices from 2D to 3D architectures has elevated the strategic importance of plasma etch and thin-film deposition equipment. AMEC highlighted strong product reserves in silicon-germanium epitaxy (SiGe EPI) and PECVD, and said it will accelerate the rollout of more advanced etch and thin-film tools to memory customers, the report adds.
As previously reported by the Economic Daily News, AMEC benefited from a sharp increase in shipments of advanced etch tools, reporting 2025 revenue of RMB 12.38 billion, up 36.6% year on year, while net profit rose 30.6% to RMB 2.11 billion.
Separately, an analyst’s column on Zhihu spotlights NAURA Technology as a “full-stack” semiconductor equipment provider, with a portfolio spanning both etch and deposition tools. Among its flagship offerings, the Accura LX — a 12-inch capacitively coupled plasma (CCP) dielectric etch system — is highlighted as a strong competitive contender in the market, the report adds.
Jingce, Changchuan Among Testing Equipment Winners in Memory Upcycle
On the other hand, Jiemien News highlights Wuhan Jingce Electronic Group Co., Ltd, a supplier of front-end inspection and back-end testing equipment, as another key beneficiary of the memory expansion cycle, with major customers including SMIC and leading Chinese memory makers.
According to the report, the company’s full-year net profit for 2025 is projected at RMB 80–90 million, up roughly 182%–192% year on year.
Zhihu further notes that DRAM and NAND Flash testers require high throughput, large-scale parallel testing, and continuous upgrades to evolving standards, making R&D highly intensive. Alongside Wuhan Jingce Electronic Group, the report also highlights Hangzhou Changchuan Technology, the only domestic player capable of mass-producing testers for memory devices above 256Gb.
Hwatsing, ACM Research Lead China’s Advanced Packaging Equipment Push
Zhihu notes that packaging equipment is critical for enabling HBM and CoWoS-based advanced packaging, supporting GPU–HBM high-bandwidth integration and 2.5D/3D architectures. In this sector, key Chinese players include Hwatsing (wafer thinning), ACM Research Shanghai (plating), Kingsemi (coating and bonding), Piotech (bonding), and JSG (thinning tools), the report suggests.
According to EE Times China, ACM Research develops and sells equipment for IC fabrication and advanced wafer-level packaging, covering wet cleaning and electroplating tools. The domestic frontrunner in both segments, the company serves fabs globally and is targeting a 50–60% market share in cleaning and plating equipment, the report says.
The report also spotlights Hwatsing, noting that its 12-inch wafer thinning-and-lamination system — compatible with both W2W and D2W processes — has entered volume shipment. Once a pure-play CMP leader, Hwatsing has broadened into a full equipment platform, with its thinning and dicing tools well-positioned to ride the chip-stacking demands of AI and HBM, according to EE Times China.
Read more
- [News] China’s Etching Tool Giant AMEC Flags Up to 35% Profit Growth in 2025 as Thin-Film Sales Soar
- [News] Memory Boom in China Reportedly Spurs Opportunities for Korean Makers Hanmi, SEMES
(Photo credit: AMEC)
