[News] SanDisk Reportedly Eyes 2H26 HBF Pilot Line; May Advance Previously Announced Timeline by Half a Year

SanDisk is reportedly moving to establish a supply chain for HBF, a next-generation memory that stacks NAND. According to ETNews, sources say the company has begun engaging materials, components, and equipment partners to build out an ecosystem for an HBF prototype production line. It aims to introduce prototypes in the second half of this year, with Japan emerging as a leading candidate for the production site. The industry expects the pilot production line to be completed in the second half and begin operation around year-end, with commercialization targeted for 2027, as the report notes.

Sources cited by The Bell further note that as sample production ramps up in earnest, SanDisk may advance its previously outlined HBF development timeline by around half a year, signaling a strong push to take the lead in the market.

Meanwhile, as noted by ETNews, equipment for HBM production, along with the broader materials and components ecosystem, is expected to retain its technological edge in HBF, given the similarities between the two processes. Through-silicon vias (TSVs) are used to enable signal transmission between stacked NAND dies, while bonding materials and equipment for die attachment are also likely to remain led by companies that have already established strong competitiveness in the HBM market.

South Korean materials suppliers are also making moves in the HBF space. According to Dealsite, JK Materials, a subsidiary of Hanul Materials Science, recently announced that it has completed the development of high-performance polymers for HBF for supply to major Chinese customers. The report adds that JKM’s high-performance KrF polymer is a critical chemical material required to stack hundreds of NAND flash layers.

SK hynix, SanDisk Push HBF Standards; Samsung Reportedly Expands Patent Portfolio

Regarding SK hynix’s progress in HBF development, in February 2026, SK hynix and SanDisk jointly hosted the “HBF Spec. Standardization Consortium Kick-Off” on Feb. 25, unveiling a global standardization roadmap for HBF aimed at the AI inference era, according to SK hynix. Industry projections suggest demand for advanced memory solutions, including HBF, is likely to accelerate around 2030, the company stated.

As for Samsung, Chosun Biz reports that Samsung Electronics has been researching HBF since the early 2020s. The company is also seen actively securing related technologies, including the recent acquisition of a series of HBF-related patents. While it has yet to make an official announcement like SK hynix, Samsung appears to be steadily exploring opportunities to expand into the HBF sector.

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(Photo credit: SanDisk)