[News] Micron Launches $24 Billion NAND Expansion in Singapore, Wafer Output Slated for 2028

As global memory demand outstrips supply, memory giants are racing to expand—Micron among the most aggressive as 2026 kicks off. According to Reuters, the U.S. chipmaker is set to announce a new investment in Singapore to boost memory chip production, with at least part targeting NAND flash—a rare step even among top-tier memory firms.

Shortly after the Reuters report, Micron announced it has broken ground on a new advanced wafer fab within its existing NAND complex in Singapore. The $24 billion (SG$31 billion) project over 10 years will eventually provide 700,000 square feet of cleanroom space, with wafer production scheduled to start in the second half of 2028.

Micron said the facility is designed to meet surging NAND demand fueled by the rapid growth of AI and data-centric applications, and this new fab will become an integral part of Micron’s NAND Center of Excellence in Singapore.

The move underscores Micron’s flurry of recent moves to tackle the global memory shortage. On January 18, the U.S. memory giant unveiled plans to acquire PSMC’s Tongluo fab in Taiwan (excluding production equipment) for US$1.8 billion. According to TrendForce, Micron will deploy both existing and new equipment in phases throughout 2026–2027, focusing on front-end tools for advanced DRAM production, with mass production slated for 2027.

Micron’s planned Singapore investment could mark a rare bold move, as Samsung and SK hynix are said to be taking a more cautious approach to NAND expansion. Chosun Biz previously reported that both Korean giants may slightly reduce their NAND output in 2026, as they prioritize spending on DRAM.

According to Reuters, Micron already operates large-scale manufacturing facilities in Singapore, producing 98% of its flash memory chips there. The company is also constructing a $7 billion advanced packaging plant for HBM—scheduled to begin production in 2027, Reuters notes.

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(Photo credit: Micron)