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U.S. President Trump has approved the export of NVIDIA’s H200 chips to China. According to Commercial Times, industry sources say the move could accelerate inventory digestion across the AI supply chain and stimulate new orders for Taiwanese assembly and packaging providers. OEMs such as Gigabyte and Asus, along with major OSAT firms like ASE, are expected to be among the first to benefit.
As the report indicates, the H200 is built on TSMC’s 4nm process and belongs to NVIDIA’s previous-generation product line. Demand fell sharply over the past year due to export restrictions, resulting in elevated inventory. Sources note that most of this inventory sits with NVIDIA and Taiwanese module assemblers, meaning that once restrictions are lifted, the first beneficiaries will be the Taiwanese firms handling assembly and shipment.
The report adds that U.S. and European customers have already transitioned to Blackwell (the B-series) chips, reducing the significance of the H-series in the high-end market and making it a more suitable alternative for China.
As for whether NVIDIA will increase wafer starts for the H-series, the report notes that the likelihood is low, as the Blackwell line commands higher ASPs and remains in strong demand, and with N4P capacity already tight, resuming production of older chips would divert scarce manufacturing resources.
H200 Revival: From Packaging to Testing, Taiwan Suppliers See Opportunity
If the H200 returns to the market, it could lift utilization rates for advanced packaging and testing capacity. According to the report, institutional investors note that Taiwanese firms such as ASE, Powertech, and KYEC—strong in high-speed transmission, high-frequency packaging, and burn-in testing—would benefit most directly as AI and cloud customers in China resume procurement. The report also adds that because the H200 adopts HBM stacked packaging, it could help restart the pull-in cycle across Taiwan’s AI supply chain.
In addition, the report notes that although major AI server ODMs—including Wistron, Foxconn, Quanta, and Inventec—have been shifting their core products from the Blackwell platform to its successor, the Blackwell Ultra series, OEMs such as Gigabyte and Asus continue to fulfill some H200 orders in markets like Southeast Asia and the Middle East.
Meanwhile, Economic Daily News notes that Inventec is part of the supply chain for Chinese cloud service providers such as Alibaba and Baidu. Institutional investors cited by the report expect that following the H200 export approval, new L6 (motherboard) design and manufacturing orders will emerge, helping drive an increase in Inventec’s server shipments.
TrendForce predicts that China’s high-end AI chip market will grow by over 60% in 2026. The Chinese government is likely to keep supporting local AI chip independence, helping top IC design companies benefit from government and corporate projects. Consequently, domestic AI chips might increase their market share to about 50%. At the same time, imported products like NVIDIA’s H200 and AMD’s MI325 are expected to hold nearly 30% of the market.
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