[News] Intel Faces Another Executive Exodus: Advanced Packaging Director Leaves for Analog Devices

While Intel recently agreed to transfer a 10% stake to the U.S. government, the chipmaker continues to suffer from a wave of veteran executive departures. As per Oregon Live, Narahari Ramanuja, a 25-year Intel veteran, is leaving to head Analog Devices’ newly expanded Oregon facility.

Notably, according to his LinkedIn profile, Ramanuja has spent over three years as Intel’s Director of Advanced Packaging Technology Development. As EE Times previously reported, Intel’s manufacturing unit is encouraging customers to shift designs from TSMC’s CoWoS to Intel’s Foveros advanced packaging amid tight supply—though the company still has substantial capacity to fill.

Ramanuja is set to become Managing Director and General Manager of Analog Devices’ Beaverton FAB, starting in late September, per his LinkedIn profile.

Ramanuja is not the only Intel packaging veteran leaving the company. According to The Wall Street Journal, Gang Duan, a longtime Intel expert in chip packaging, has left to join Samsung’s components division. The report highlights Duan’s key contributions to advancing semiconductor packaging technologies, particularly his innovative use of glass materials.

Intel Hit by Executive Turnover

Oregon Live highlights that Oregon has been the epic center of Intel’s recent massive layoffs, which cut about 15,000 jobs in 2024 and another 15,000 just last month. Intel’s Oregon headcount has shrunk by more than 5,400 over the past year, the report notes.

Meanwhile, the company has seen several veteran executives leave amid cost-cutting and restructuring. Oregon Live suggests that Ann Kelleher, head of manufacturing, retired in March, followed by Sanjay Natarajan, VP of factory technology research, in June. Reuters reports that three more senior manufacturing executives—including corporate VPs Kaizad Mistry, Ryan Russell, and Gary Patton, corporate VP of the Design Technology Platform organization—are also set to retire.

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(Photo credit: Intel)