[News] LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028

As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily.

Sedaily suggests a company spokesperson confirmed that LG’s Production Engineering Research Institute (PRI) is indeed developing the equipment, which is reportedly targeting mass production by 2028.

The move makes sense, as Financial News previously reported that traditional methods like TC bonding face yield challenges beyond 16-high HBM products. In contrast, hybrid bonding—by directly connecting chips without bumps—enables thinner stacks, more layers, reduced signal loss, and better yields.

According to Sedaily, LG’s main competitors in hybrid bonders are global companies like BESI and Applied Materials. Meanwhile, Korean memory leaders SK hynix and Samsung are working closely with local partners to develop this technology for HBM production, which reportedly creates an opportunity for LG to break in.

Samsung, SK hynix Could Embrace Hybrid Bonding for HBM4

Sedaily notes that Samsung is building hybrid bonders through its subsidiary SEMES for its own HBM lines. According to the report, Samsung is expected to begin trial production of sixth-generation HBM (HBM4) using hybrid bonding technology by the end of this year.

On the other hand, Sedaily suggests that SK hynix is expected to follow Samsung by adopting hybrid bonding for HBM4E, while Hanwha Semitek—already a major TC bonder supplier to SK hynix—is ramping up its hybrid bonder R&D. Meanwhile, Financial News points out that although Hanmi Semiconductor, the current TC bonder leader, is also developing hybrid bonders, insiders say it still lacks mass production experience.

As Sedaily points out, while hybrid bonding is already being used in NAND flash and system semiconductors, it has yet to be commercialized for HBM.

Read more

• [News] Samsung Rumored to Adopt Hybrid Bonding Patent from China’s YMTC for 400+ Layer NAND
• [News] The TC Bonder Dispute: Is Hybrid Bonding for 16Hi HBM the Spark Behind the Hanmi-SK hynix Rift?

(Photo credit: LG Electronics)