[News] Cadence to Expand Collaboration with Samsung Foundry

On July 8, Cadence officially announced via its WeChat account that the U.S.-based company has recently decided to expand its collaboration with Samsung Foundry. The two parties have signed a new multi-year IP agreement to extend the deployment of Cadence® memory and interface IP solutions on Samsung Foundry’s advanced SF4X, SF5A, and SF2P process nodes. These solutions will support high-performance, low-power applications in AI data center, automotive system, and next-generation RF connectivity.

By combining Cadence’s AI-driven design and silicon solutions with Samsung’s advanced manufacturing technologies, the collaboration aims to accelerate the time-to-market (TTM) for cutting-edge system-on-chip (SoC), chiplet, and 3D-IC products built on Samsung’s leading-edge nodes.

Samsung noted that Cadence’s full suite of digital tools—from RTL to GDS—has now been certified for its latest SF2P process node and supports advanced technologies such as Hyper Cell and LLE 2.0. Cadence will also work closely with Samsung to leverage GPU acceleration for analog migration, improve power integrity, and enhance thermal and warpage analysis in 3D-ICs. In addition, the multi-year agreement will further expand memory and interface IP solutions, strengthening the long-standing partnership between the two companies.

According to Cadence’s press release, the expanded SF4X IP portfolio includes LPDDR6/5X-14.4G, GDDR7-36G, DDR5-9600, PCI Express® (PCIe®) 6.0/5.0/CXL 3.2, Universal Chiplet Interconnect Express™ (UCIe®)-SP 32G, and 10G multi-protocol PHY (supporting USB3.x, DP-TX, PCIe 3.0, and SGMII). Accompanying controller IPs provide complete subsystem silicon solutions. For automotive applications, a dedicated LPDDR5X-8533 PHY IP enhances the SF5A IP platform, while the addition of a 32G PCIe 5.0 PHY enriches the SF2P portfolio, targeting the needs of leading AI and HPC customers.

(Photo credit: Cadence)