[News] Samsung Reportedly Nears NVIDIA HBM3E Approval, But Order Outlook Remains in Doubt

Samsung has been working hard to pass NVIDIA’s qualification test for its 12-layer HBM3E. However, even if successful, the company is unlikely to see significant short-term revenue, according to a report from Deal Site. While Samsung may complete the qualification later this year, the report notes that large-scale orders remain unlikely, as SK hynix—an early entrant into the supply chain—is already supplying 12-layer HBM3E for the GB300 and currently holds a dominant share of the order volumes.

Nevertheless, the report indicates that given NVIDIA’s interest in diversifying its supplier base, Samsung could still increase its share of the company’s HBM supply if it improves product quality.

The report, citing sources, states that Samsung’s 12-layer HBM3E has effectively passed NVIDIA’s bare-die certification and is reportedly considered “usable.” The product is now undergoing full-package verification, the report highlights.

According to the report, the HBM qualification process involves two stages: bare-die certification, which evaluates the DRAM chip’s standalone performance, and full-package certification, which tests the chip in its final stacked form.

Samsung Optimistic About HBM Outlook

Meanwhile, as noted by the report, Samsung is said to be optimistic about its HBM business prospects this year and has revised its supply targets upward. In the first quarter, the company’s HBM sales volume was estimated to be under 1 billion gigabits (Gb), with similar levels anticipated for the second quarter. However, taking into account the potential to supply NVIDIA in the latter half of the year, Samsung expects its HBM sales to more than double in the third quarter, the report adds.

In addition, as HBM4 has become the next battle ground for memory giants, Samsung seems to be aiming to close its gap with SK hynix through aggressive investment. According to ZDNet, Samsung plans to expand 1c DRAM (6th-gen 10nm-class) production in both Hwaseong and Pyeongtaek, with investments starting by year-end, while SK hynix and Micron will use 1b DRAM for HBM4.

Read more

• [News] Samsung Reportedly Plans 1c DRAM Expansion for HBM4 in Hwaseong and Pyeongtaek by Year-end
• [News] Samsung Reportedly Achieves Stable 40%+ Test Yield for 4nm Logic Die, Accelerating HBM4 12-High Development

(Photo credit: Samsung)