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[News] Micron’s 12hi HBM3e Could Top 8hi Shipments by August, Backed by Strong CSP Buzz


2025-05-19 Semiconductors editor

While Samsung races full steam ahead with its 12hi HBM3e validation and HBM4 development, Micron stays under the radar. But according to New Daily, the U.S. memory giant is quietly gaining ground—its 12hi HBM3e yields are rapidly improving, earning rave reviews from major CSPs.

Citing Micron’s remarks at an investor’s conference, the report suggests that the company is betting big on 12hi HBM3E, and expects the product to surpass its current 8hi HBM3e in shipment volume as early as August, aiming to hit stable yield levels by the end of Q3.

In addition, as per New Daily, with NVIDIA likely to speed up the launch cycle of its next-gen Rubin GPU, HBM4 production is expected to kick off about six months earlier than planned. While SK hynix leads with HBM4 mass production starting in late 2025, Micron is gearing up to jump in early 2026, right after ramping up its 12hi HBM3e, the report adds.

As per TechNews, Micron shows in its AI memory portfolio that its next-generation HBM4 is expected to enter mass production in 2026, followed by HBM4E in subsequent years, in 2027-2028.

Micron does have a reason of being confident. As per Sisa Journal, while SK hynix has long ruled the HBM market, Micron is rapidly closing the gap with top-tier products—its 12hi HBM3e is already powering NVIDIA’s B300.

Notably, the report suggests that Micron may have less overall DRAM capacity than SK hynix, but its higher share of cutting-edge 10nm-class 1b processes gives it a quality edge—especially in heat management, a key factor for HBM.

According to New Daily, growing uncertainty over U.S. tariffs may give Micron a strategic advantage. As a U.S.-based company with major clients like NVIDIA and leading American cloud providers, analysts cited by the report suggest Micron could stand to benefit if trade tensions prompt a shift toward domestic suppliers.

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(Photo credit: Micron)

Please note that this article cites information from New Daily, Sisa Journal and TechNews.


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