[News] China Breaks Into Panel-level Packaging: CFMEE’s 510×515mm PLP System Passes Validation

As global foundry and OSAT leaders accelerate investments in panel-level packaging for ever-larger AI chips, Chinese players are also moving into the space, now extending the push into equipment as well.

Among them, Circuit Fabology Microelectronics Equipment has announced that its in-house developed PLP 2000—the country’s first 510×515mm panel-level packaging (PLP) direct-write lithography system—has successfully completed technical qualification and secured orders from key customers in the advanced packaging sector, according to ijiwei.

The milestone could mark China’s first domestically developed large-panel advanced packaging lithography tool to enter commercial deployment, the report adds. The company further notes that PLP 2000 is designed to support panel sizes of up to 600×600mm, addressing the requirements of advanced packaging flows such as CoPoS, glass substrates, and FOPLP, while delivering 2μm-class resolution for mass production.

Ijiwei adds that similar panel-level direct-write lithography systems have long been dominated by overseas suppliers. With the commercialization of CFMEE’s PLP 2000, China is expected to close a critical gap in its advanced packaging equipment ecosystem while significantly lowering equipment procurement and maintenance costs for domestic OSAT companies, the report suggests.

CFMEE to Benefit from Strong CoWoS Demand

Notably, CFMEE officially listed on the Hong Kong Stock Exchange’s Main Board on June 26. According to South China Morning Post, the company has priced its shares at HK$252.73 each, targeting up to HK$3.2 billion (US$410 million) in fundraising.

Notably, Eastmoney.com, citing market estimates, reports that CFMEE ranked as the world’s largest PCB direct imaging equipment supplier with an 18.8% market share, and placed fourth globally in direct-write lithography with a 9.4% share.

The report further highlights that while PCB direct imaging equipment and automated production line systems remain the company’s core cash-cow business—contributing 76.7% of revenue in 2025—its semiconductor direct-write lithography segment has emerged as a key second growth engine, with revenue from the business surging 112.5% year-on-year in 2025.

It is worth noting that, according to Eastmoney.com, CFMEE’s flagship WLP2000 wafer-level direct-write lithography tool is priced at roughly RMB 15–20 million per unit, with a minimum feature size of 2μm and overlay accuracy of 500nm. Designed for RDL redistribution layer processes in AI compute packaging such as CoWoS-L, the system has already entered TSMC’s supply chain and achieved batch shipments to leading Chinese OSAT players including JCET and Tongfu Microelectronics, the report adds.

Read more

• [News] China Memory Expansion Lifts Domestic Equipment Suppliers: AMEC, Wuhan Jingce, Hwatsing, ACM in Focus
• [News] China’s Domestic Chip Equipment Adoption Beats 2025 Target at 35%, Led by NAURA, AMEC

(Photo credit: CFMEE)