[News] Macronix NAND Sales Jump 382% YoY on Samsung’s MLC Exit, Shifts to Monthly Pricing Amid Deepening Crunch
Global memory makers’ shift toward high-capacity products is reshaping the market, with Taiwan’s Macronix emerging as a key beneficiary. According to Economic Daily News, following Samsung’s exit from MLC NAND, Macronix’s NAND revenue share jumped from 21% to 30% in the first quarter of 2026, rising 90% QoQ and 382% YoY.
Meanwhile, Commercial Times, citing Chairman Miin Wu, also reports that tightening supply in the 4Gb–32Gb segment—where Macronix remains a key supplier—has fueled strong substitution demand. This drove the company’s eMMC revenue up 94% QoQ and nearly 40x YoY, the report adds.
Macronix has already raised prices for both NOR Flash and SLC NAND and shifted to a monthly negotiation model to stay responsive to fast-moving market conditions, according to Economic Daily News. Liberty Times, reports Wu as saying that a severe NAND supply shortage continues to support price hikes, with momentum strong enough for each quarter this year to potentially outperform the previous one.
Notably, TechNews, citing analysts, attributes the pricing strength to major supply-side shifts, including Kioxia and Micron gradually exiting the SLC NAND segment, alongside tightening availability in NOR Flash. The report adds that against this backdrop, contract prices for Macronix’s NOR and SLC NAND are expected to rise by nearly 100% in 2Q.
Macronix posted 1Q consolidated revenue of NT$10.469 billion, rising 35% QoQ and 71% YoY. Gross margin expanded sharply by 16.6 percentage points to 40.8%, with net profit reaching NT$1.779 billion and EPS at NT$0.90.
In terms of product breakdown, NOR flash remained the largest revenue contributor at 58% in 1Q26, while NAND flash surged to 30% of revenue. ROM and foundry (FBG) accounted for roughly 8% and 4%, respectively.
NAND Upside vs. Capacity Limits
According to Commercial Times, the company aims to focus on low-density, high-margin products with monthly pricing. On tech, 96-layer 3D NAND is fully in production, 192-layer is nearing completion, and 300+ layers remain under development, the report notes, adding that its automotive eMMC controller samples are targeted for late 1Q 2027.
Liberty Times also highlights tightening capacity at Macronix. Citing Chairman Miin Wu, the report notes that the company’s 12-inch fabs are already fully utilized, with production flexibly allocated across ROM, EPROM, Flash and eMMC.
Notably, Wu, as per the report, noted delays due to industry-wide equipment shortages—driven in part by aggressive fab buildouts including TSMC—meaning most tools will only be delivered in 1H27.
According to the report, Macronix’s total capacity is effectively capped at around 25,000 wafers per month, with further upside hinging on equipment optimization, while utilization is expected to reach full load in the second half of the year. The company’s NT$22 billion capex plan will mainly go toward eMMC expansion, with no upward revision currently planned, Liberty Times suggests.

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(Photo credit: Macronix)