[News] Inside Look at Micron’s Newly Opened Sanand Plant: 10% of Global Output, Key Products and Clients

With the launch of Micron’s semiconductor assembly and test facility in Sanand, Gujarat on February 28, India has formally stepped onto the global memory map. Below are key highlights of the new plant, its role in Micron’s worldwide operations, and why it represents a pivotal milestone in India’s chip drive.

India Hits Semiconductor Milestone

According to local media Adda 247 Current Affairs, Micron’s Sanand plant represents India’s first advanced memory ATMP operation, unveiled in the presence of Prime Minister Narendra Modi. Notably, the report highlights that the site features a 500,000-square-foot raised-floor cleanroom — the largest of its kind worldwide.

Taipei Times adds that the facility will transform advanced semiconductor wafers sourced from Micron’s global network into finished memory and storage products, strengthening India’s position in the semiconductor value chain.

Chosun Biz points out that a total of $2.75 billion was invested in building the facility. The Indian central government reportedly provided 50% of the funding in subsidies, while the state of Gujarat contributed 20%. Under its “Semicon India” initiative, the Indian government plans to allocate $10 billion in semiconductor incentives, the report suggests.

Taipei Times, citing Modi, notes that in addition to Micron’s new plant, at least three additional semiconductor projects are set to enter production in the near term, signaling accelerating momentum in the sector. According to the report, New Delhi is also advancing 10 chip-related projects valued at over US$18 billion, including two 3nm design centers in Noida and Bengaluru.

Sanand Plant Powers Micron’s Chips and Global Clients

Notably, the Sanand plant not only advances India’s semiconductor ambitions but also serves as a critical hub for Micron. Business Standard reports that at full capacity, the facility could account for up to 10% of Micron’s global output, supplying both domestic and international markets.

Micron, on the other hand, states that the company expects to assemble and test tens of millions of chips at Sanand in 2026, scaling to hundreds of millions in 2027. Adda 247 Current Affairs reports that shortly after launch, the facility dispatched its first DRAM module to Dell Technologies and is set to serve global customers including Asus and Qualcomm.

According to Chosun Biz, the Micron India plant will serve as a testing and packaging hub for high-performance AI memory products, including stacked GDDR (Graphics DRAM) and enterprise SSDs. As highlighted by the report, through the Gujarat facility, Micron has begun producing DDR5 DRAM using its 1-gamma process node.

Supplier behind the Scenes

South Korean chip equipment firms also contribute to Micron’s India project. ZDNet reports that Hanmi Semiconductor, a key Micron partner, attended the opening of Micron’s Sanand plant on February 28 as well. Chosun Biz adds that Hanmi Semiconductor will dispatch engineers to India to provide technical support and run training programs as part of a long-term partnership.

Maeil Business Newspaper suggests that Hanmi Semiconductor has already been collaborating with Micron on TC bonders for HBM. In late February, Hanmi unveiled its new BOC COB bonder, which combines Board-on-Chip (BOC) and Chip-on-Board (COB) processes into a single platform.

According to the report, BOC uses flip-chip technology and is mainly applied in high-speed DRAM such as GDDR, where fast signal transmission is essential. COB, on the other hand, follows a non-flip approach and is widely used for high-capacity NAND flash products, including enterprise SSDs (eSSD), the report adds.

The report highlights that the new BOC COB bonder builds on Hanmi’s TC bonder expertise, especially in thermal management, and offers advanced precision controls in both the chuck table and bonding head. Notably, the tool is slated for deployment at Micron’s new Gujarat facility, the report notes.

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(Photo credit: Narendra Modi’s X)