[News] Micron to Break Ground on U.S.’s Largest Chip Plant in New York on Jan. 16 After Years of Delays

After facing delays with its U.S. expansion, Micron is taking a major step forward, announcing the groundbreaking date for its massive chipmaking complex in Clay, New York. The ceremony is scheduled for January 16, according to the company and syracuse.com.

Micron says that with up to four fabs, the Clay complex will become the largest semiconductor facility in the U.S. According to syracuse.com, the total investment of $100 billion will fund a phased rollout: the first factory is slated to open in 2030, the second in 2033, and the fourth by 2045, ultimately supporting 9,000 jobs when fully completed.

As syracuse.com points out, Micron first unveiled the ambitious project more than three years ago, with construction originally planned for mid-2024. Progress has been slowed, however, by a 20,000-page environmental review, the report notes, adding that while the company has secured most state and local permits, federal approvals are still pending.

At Micron’s earnings call in December, CEO Sanjay Mehrotra highlighted that Micron has already locked in pricing and volume agreements covering its entire calendar 2026 HBM supply, including HBM4. The company also plans to raise FY26 capital expenditures to USD 20 billion, up from USD 18 billion.

Alongside New York, Micron is accelerating its Idaho expansion. According to Micron, the first Idaho fab has hit key construction milestones, with DRAM production set for 2027, while the second fab is expected online before the first New York plant. These U.S. investments aim to meet growing demand, protect market share, and achieve Micron’s goal of producing 40% of its DRAM domestically.

Nikkei previously reported that Micron operates major plants in Taiwan and the U.S., with production of its advanced HBM chips currently focused in Taiwan. In addition to its U.S. expansion, Micron also aims to break ground on a new factory within its Hiroshima Plant compound in Higashi-Hiroshima in May 2026, targeting the start of HBM chip shipments around 2028, according to Nikkei.

Read more

• [News] Micron Reveals Three Culprits Behind Memory Crunch—and Why It Won’t Ease Soon
• [News] Micron’s New York Megafabs Reportedly Face 2–3 Year Delay, First Now Set for Late 2030

(Photo credit: Micron)