[News] MediaTek Reportedly Secures Google v7e, v8e TPU Orders, Requests 7-Fold CoWoS Increase from TSMC

While Broadcom signaled strong demand from Google TPUs via Anthropic during last week’s earnings call, another leading Taiwanese ASIC supplier, MediaTek, is reported by the Economic Daily News to have secured orders for Google’s v7e and v8e TPUs. Supply chain sources cited by the report note that these orders far exceed initial expectations, prompting TSMC to plan a more than sevenfold increase in CoWoS capacity for MediaTek’s Google projects by 2027.

The report suggests that MediaTek’s first TPU for Google, the v7e, is set to enter risk production by the end of next quarter, while the company has also secured orders for Google’s next-generation v8e TPU. Thus, this reportedly prompts the company to expand advanced process and CoWoS packaging capacity with TSMC’s backing.

Notably, the Economic Daily News reports that MediaTek initially secured around 10,000 CoWoS wafers annually from TSMC for its Google project in 2026. However, with surging v7e demand, this number has reportedly doubled to 20,000 wafers. Valuing its partnerships with MediaTek and Google, TSMC is supporting the project with ample 3nm process and CoWoS packaging capacity, the report adds.

As v7e ramps up, MediaTek is set to capitalize on Google’s next-generation v8e as well. Sources cited by the report indicate that by 2027, MediaTek may negotiate for over 150,000 CoWoS wafers annually—more than seven times the 2026 level.

For more context, Commercial times reported that by the end of 2026, TSMC aims to scale monthly CoWoS capacity from today’s 75,000–80,000 wafers to as high as 120,000–130,000. Currently, NVIDIA has locked in over half of TSMC’s CoWoS production, with Broadcom and AMD trailing behind, according to Wccftech.

The Economic Daily News notes that although MediaTek has not disclosed the clients or product names for its ASIC projects, CEO Rick Tsai previously stated that the company’s first AI accelerator ASIC project is progressing smoothly. He reaffirmed the target of generating $1 billion in cloud ASIC-related revenue by 2026, with expectations to reach several billion dollars by 2027, the report adds.

Read more

• [News] TSMC Speeds Advanced Packaging: AP7 Targets 2026 Output; Arizona P6 Eyed for U.S. Packaging Hub
• [News] Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply

(Photo credit: Google’s X)