[News] Micron’s New York Megafabs Reportedly Face 2–3 Year Delay, First Now Set for Late 2030

While Micron has already sold out its 2026 HBM supply, the company appears to be taking a cautious approach to capacity expansion. According to syracuse.com and Spectrum News 1, the opening of its first two chip fabs in Clay, New York, will be delayed by two to three years, meaning neither facility is expected to come online before late 2030.

This is not the first time the U.S. memory giant has pushed back its New York fab timeline. According to the approved Final Environmental Impact Statement released last Friday cited by sycacuse.com, the initial fabrication plant, previously scheduled for mid-2028, is now projected to come online in late 2030, marking eight years since Micron first announced its Central New York project in 2022.

Meanwhile, the second fab’s completion has been rescheduled from late 2030 to late 2033, as per syracuse.com.

Spectrum News 1 notes that Micron’s first New York fab is now set to break ground in Q2 2026, while its second fab is expected to start construction in Q4 2030.

According to Spectrum News 1, Micron still plans to build four fabs in New York. However, Fab 3’s construction is now pushed back two years to Q3 2035, while Fab 4 is delayed by one quarter and is not expected to be completed until 2041, the report reveils.

What’s Behind Micron’s Delays

It is worth noting that the delays impact not just the start of construction but also its duration. As highlighted by syracuse.com, Micron’s first fab’s build period has grown from three to four years. While Micron did not specify the reasons behind the delays, the company confirmed—per the report—that its $6.1 billion funding agreement with the U.S. Commerce Department was recently updated, pushing back by about two years the window for exercising its option to begin operations at Fabs 1 and 2.

Under the revised plan, Micron now appears poised to prioritize its Boise expansion over New York. Syracuse.com reports that the updated Commerce Department agreement requires Micron to build a second fab at its Boise, Idaho headquarters. That facility—along with another Boise fab already under construction—is set to open ahead of any of the Clay sites, the report notes.

Syracuse also points to labor shortages as another factor behind the delay. The report explains that U.S. chipmakers are struggling to find enough skilled workers, and fab projects are taking longer than expected—circumstances that may have prompted Micron to build in more flexibility for its construction timeline.

Meanwhile, Micron’s new plant in Hiroshima, Japan, is also moving forward, though with minor delays. According to Nikkei, Micron plans to pour 1.5 trillion yen into the fab by the end of fiscal 2029 to produce next-generation chips, with shipments targeted for the June–August 2028 window. The company aims to scale the facility to a peak output of 40,000 wafers per month, a level it expects to reach between March and May of 2030, the report adds.

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(Photo credit: Micron)