[News] Apple Reportedly Takes Most of TSMC’s 2nm Capacity for A20 Series in Foldable iPhone and iPhone 18

Apple’s first foldable iPhone—expected in 2026 and reportedly featuring a design similar to Samsung’s Galaxy Z Fold, according to Bloomberg—is drawing strong market attention. Yet its biggest upgrade may lie inside: the device will run on Apple’s new A20 Pro chip, built on TSMC’s 2nm process, as reported by Commercial Times and cnBeta.com.

Commercial Times notes that Apple has already secured most of TSMC’s initial 2nm capacity for the A20 lineup, which will debut next year. As per cnBeta, the A20 series is expected to be the first iPhone processor built on TSMC’s 2nm process, succeeding the 3nm-based A17 Pro through A19 Pro chips.

Citing the Weibo account “Mobile Chip Expert,” cnBeta adds that the standard iPhone 18 will use the A20, while the iPhone 18 Pro and foldable iPhone will feature the A20 Pro. However, the source cited by the report did not specify which chip will be used in the entry-level iPhone 18e or the second-generation iPhone Air.

According to TrendForce, Apple is likely to launch its first foldable phone in the second half of next year, featuring a 5.5-inch external display and a 7.8-inch internal display. If confirmed, Apple’s entry is expected to significantly boost consumer interest and acceptance of foldables, particularly among high-end users.

2nm Battleground for Smartphone Chipmakers

Compared with this year’s 3nm process, TSMC’s 2nm technology promises a significant leap—performance gains of up to 15% and power savings of around 30%, according to the company—further advancing Apple’s push for in-house silicon.

Notably, Apple won’t be the only one on TSMC’s 2nm node, though it may be slightly ahead. Commercial Times reports that 2026 marks TSMC’s first year of 2nm commercialization, with Apple, Qualcomm, and MediaTek all racing to launch products. MediaTek, for example, announced in September the tape-out of its first 2nm flagship SoC, likely the Dimensity 9600, with mass production slated for late 2026.

However, Commercial Times adds that with 2nm capacity tight, Apple’s bulk preorders secure both pricing power and strategic control.

Apple Silicon Expands Across Devices with TSMC

Industry observers cited by Commercial Times note that thanks to TSMC’s advanced processes, Apple Silicon now powers nearly every key module across Apple devices, not just core processors.

The report further notes that Apple’s lineup this year already includes the C1X and N1 (Wi-Fi) chips, built on TSMC’s 4nm and 6nm nodes. Next year, Apple’s in-house C2 chip, debuting on TSMC’s 4nm process, is expected to power the iPhone 18 series as well, further extending Apple’s silicon integration, according to Commercial Times.

On the other hand, Commercial Times suggests that Apple’s newly upgraded AirPods Pro 3, which adds real-time translation features, also features the company’s in-house H2 SoC, while its charging case houses the U2 chip, a 7nm design that enables UWB and short-range communication capabilities.

Read more

• [News] Apple Reportedly Plots Bold iPhone Makeover, Foldable Coming in 2026, Boosting TSMC
• [News] Apple’s First Foldable iPhone May Debut in Fall 2026, Made by Foxconn
• Accelerated Brand Expansion Reshapes Foldable Phone Market; Apple’s 2026 Entry May Ignite Industry Breakthrough, Says TrendForce

(Photo credit: Apple)