[News] Broadcom Enters OCP’s ESUN Initiative After Exiting UALink Board; NVIDIA, AMD Added to OCP Board

According to TechNews, as AI-driven data centers continue to expand in both scale and energy consumption, the Open Compute Project (OCP) unveiled a series of key collaborations at its 2025 Global Summit. Notably, Broadcom—formerly a founding member of the UALink consortium—joined the initial group of OCP members launching the ESUN (Ethernet for Scale-Up Networking) initiative. According to China Times, Broadcom has reportedly stepped down from UALink’s board of directors. For now, the UALink Consortium does not include representatives from Broadcom, according to its official website.

As OCP’s press release notes, ESUN is a new open technical collaboration aimed at advancing Ethernet for the fast-growing AI scale-up domain. The initiative brings together major operators and vendors to develop and tailor Ethernet technologies for the specialized requirements of large-scale AI networking.

New Members ARM, AMD, and NVIDIA Join OCP Board as Open Data Center Vision Expands

In addition, according to its press release, OCP simultaneously announced the addition of AMD, ARM, and NVIDIA to its board of directors, further connecting the open ecosystem from silicon and system architecture to data centers.

TechNews notes that OCP now has more than 500 member companies worldwide, with its OCP Ready facilities and experience centers continuing to expand and being adopted by several hyperscalers. Looking forward, TechNews notes that OCP will focus its strategy on the “Open Data Center Strategic Initiative,” which seeks to drive the next generation of global data center standards.

OCP Strengthens Industry Partnerships and Launches Sustainability Framework

At the same time, OCP expanded its industry collaboration by forming alliances with three major international organizations: the Storage Networking Industry Association (SNIA), to unify AI cluster storage architectures; ASHRAE (the American Society of Heating, Refrigerating and Air-Conditioning Engineers), to jointly develop data center cooling and sustainability standards; and OIX (Open IX), to enhance OCP Ready facility and open network certifications.

Meanwhile, on the sustainability front, after a year of collaboration with Infrastructure Masons (iMasons), OCP officially launched a data center carbon emission and equipment carbon footprint reporting framework. TechNews notes that the standard, jointly developed by major hyperscale providers including Google, Meta, Microsoft, and Schneider Electric, will be integrated into the OCP ecosystem.

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(Photo credit: TrendForce at OCP Global Summit 2025)