[News] SK hynix Finalizes World’s First HBM4, Mass Production Ready, Eyes NVIDIA Approval

SK hynix announced today that it has completed the development of HBM4 and finalized preparations for mass production—the first company in the world to do so. According to its press release, the company is now ready to deliver top-tier HBM4 to customers in line with their timelines.

In its press release, SK hynix highlights that its HBM4, now ready for mass production, offers the industry’s leading data processing speed and power efficiency. Bandwidth has been doubled through the adoption of 2,048 I/O terminals—twice that of the previous generation—while power efficiency has improved by more than 40%.

The company also expects HBM4 to boost AI service performance by up to 69%, helping to overcome data bottlenecks and significantly lower data-center power costs, according to its press release. In addition, SK hynix noted that HBM4 exceeds the JEDEC3 standard operating speed of 8Gbps, reaching more than 10Gbps.

As reported by Newsis, SK hynix has reduced the risk of mass production by applying the advanced mass reflow-molded underfill (MR-MUF) process—its established packaging technology—together with 10nm-class 1b (fifth-generation) DRAM. It is also collaborating with TSMC on the production of the base die, Newsis points out.

SK hynix’s HBM4 Poised for NVIDIA Rubin

Chosun Daily reports that SK hynix’s HBM4 is reportedly in the final stage of quality testing for use in NVIDIA’s next-generation AI accelerators. With development completed and internal procedures finished, sources say the remaining validation should progress smoothly. The report adds that if SK hynix successfully clears NVIDIA’s final HBM4 tests, the memory will be adopted in NVIDIA’s upcoming AI chip, ‘Rubin,’ slated for launch next year.

The Korea Herald, citing industry sources, adds that as NVIDIA transitions its AI accelerators from the current Blackwell lineup to Rubin in the second half of 2026, its flagship memory is likewise projected to shift from HBM3E to HBM4.

Meanwhile, Newsis notes that industry attention has shifted to Samsung Electronics, which remains in a follower’s position. A previous Chosun Biz report indicates the company is reportedly two months behind rivals in testing and is working intensively to catch up.

Read more

• [News] SK hynix May Secure NVIDIA HBM4 Deal by Sep., Samsung Reportedly Trails in Testing
• 2Q25 DRAM Revenue Jumps 17.1%, SK hynix Expands Market Share as Taiwanese Vendors Deliver Strong Growth, Says TrendForce

(Photo credit: SK hynix)